Social recruitment | Module Engineer

2026-04-14 18:17

Responsibilities:

1. Maintain, monitor, and troubleshoot the full Micro LED COB packaging process, including chip testing and sorting, die bonding, wire bonding, dispensing, and testing, to ensure stable production.

2. Lead yield improvement projects for COB processes by using data analysis and DOE to identify key defect modes, implement process optimization plans, and track improvement results.

3. Demonstrate strong command of the full Micro LED COB packaging process, with deep understanding and hands-on experience in key areas such as die-bonding accuracy, bonding reliability, molding protection, and optoelectronic testing.

Qualifications:

1. Bachelor’s degree or above in microelectronics, optoelectronic engineering, materials, mechanical automation, or a related field.

2. More than 3 years of experience in semiconductor packaging processes.

3. Strong cross-functional and cross-team communication and coordination skills, with the ability to communicate technical information clearly and accurately.

4. Solid data analysis skills, with the ability to use statistical tools for yield analysis and process optimization.